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Silicon Wafer Processing

1,   Ultra Thinning / Ultra Flat

MEMS / SENSOR / IGBT / SAW / SOI / GWSS / Polish Wafer / Cavity etc;
Ultra-thin processing such as thickness 1-10um;
Silicon wafer is ultra-thinned to about 5um;
Ultra-thin LT Wafer to about 1um;

 2,  Wafer Cleaning


Metal contamination after cleaning  

3,   Edge Grining

Knife edge prevention processing
Processing Wafer Size: 4・5・6・8inch