Silicon Wafer 4inch P/N-type 0.01~0.02Ω Oxide Film 280/300/500nm Semiconductor Substrate
Silicon Wafer Specification:
- Size: 4inch;
- Method: CZ;
- Type: P;
- Dopant: B;
- Orientation:100;
- Resistivity: 0.01~0.02Ω;
- Thickness: 525um±25;
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Oxide film: 280/500nm (both sides);
- Packing: silicon wafer case ;
- Size: 4inch;
- Method: CZ;
- Type: N;
- Dopant: Sb;
- Orientation:100;
- Resistivity: 0.01~0.02Ω;
- Thickness: 525um±25/450um±25/500um±25;
- TTV<10um ;
- Surface: polished;
- Backside: etched;
- Oxide film: 280/300nm (both sides);
- Packing: silicon wafer case ;
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